Here at Internet of NSN, our team supplies and delivers NSN parts such as 82S23 BFA and Microcircuit Memory from Philips Semiconductors Inc as well as other certified producers. Our stock of items includes more than six billion new, old and out of date airline parts, along with parts for the industrial and electronics industry. One of the leading independent suppliers with a strict No China Sourcing vow, Internet of NSN has been earning its reputation as a safe and reliable parts distributor. We value our relationship with our clients which is why we have gone above and beyond in earning our ISO 9001:2015 and AS9120B certifications.
We have many NSN part numbers in our stock, including 5962013107307 and many others. If you are in a quick need to source, we are your best bet on getting that part 82S23 BFA delivered to you quickly! Simply search our parts directory for the NSN code that you need (you may also search by CAGE code or part number), and once you are able to locate the part, send in that Instant RFQ. An account manager will reach out to you in as little as fifteen minutes to provide you with a same day quote and let you know how quickly we can supply your item(s) for you. Whatever you need, be it electronic semiconductors, batteries, circuit breakers, motherboards, circuit sheets, or others, our team at Internet For NSN has the part(s) that you need.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-310-7307 Item Description: Microcircuit Memory | 5962 | 013107307 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
82s23 Bfa | 2 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.285 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND W/OPEN COLLECTOR AND BIPOLAR AND PROGRAMMABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-5 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 332.8 MILLIWATTS |
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